Logic pro update 10.7.111/9/2023 ![]() USB 3.2, released in September 2017, fully replaces the USB 3.1 specification. USB 3.1 Gen 2 Type-A and Type-B connectors and plugs are usually teal-colored. Backward-compatibility is still given by the parallel USB 2.0 implementation. USB 3.1 introduced an Enhanced SuperSpeed System to the SuperSpeed architecture and protocol, and providing a new coding schema (128b/132b symbols) and protocol named SuperSpeedPlus (sometimes marketed as SuperSpeed+ or SS+) while defining a new transfer mode called USB 3.1 Gen 2 with a signal speed of up to 10 Gbit/s and a nominal data rate of 1212 MB/s over existing Type-A, Type-B, and USB-C connections, more than twice the rate of USB 3.0 (aka Gen 1). USB 3.1 preserves the existing SuperSpeed operation mode (8b/10b symbols, 5 Gbps), giving it the new label USB 3.1 Gen 1. USB 3.1, released in July 2013, is the successor specification that fully replaces the USB 3.0 specification. ![]() ![]() USB 3.0 Type-A and B connectors are usually blue, to distinguish them from USB 2.0 connectors, as recommended by the specification. The new transfer rate, marketed as SuperSpeed USB (SS), can transfer signals at up to 5 Gbit/s with nominal data rate of 500 MB/s after encoding overhead, which is about 10 times faster than High-Speed (maximum for USB 2.0 standard). The USB 3.0 specification defined a new architecture and protocol, named SuperSpeed, which included a new lane for a new signal coding scheme (8b/10b symbols, 5 Gbps also known later as Gen 1) providing full-duplex data transfers that physically required five additional wires and pins, while preserving the USB 2.0 architecture and protocols and therefore keeping the original 4 pins/wires for the USB 2.0 backward-compatibility, resulting in 9 wires in total and 9 or 10 pins at connector interfaces (ID-pin is not wired). USB 3.0, released in November 2008, is the third major version of the Universal Serial Bus (USB) standard for interfacing computers and electronic devices. USB 3.0 Promoter Group ( Hewlett-Packard, Intel, Microsoft, NEC, ST-Ericsson, and Texas Instruments)
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